SANTA CLARA, Calif. — April 4th, 2025 — Senko Advanced Components, Inc., a global leader in fiber optic connectivity solutions, is proud to announce the integration of its innovative detachable 36-channel (36Ch) optical Photonic Integrated Circuit (PIC) connector into the Marvell® custom XPU architecture with co-packaged optics (CPO) technology based on the Marvell 6.4T light engine. This collaboration represents a major step forward in AI server performance and next-generation data infrastructure.

Building on the recent CPO architecture and silicon photonics light engine announcements from Marvell, the addition of SENKO’s detachable 36Ch optical PIC connector enables seamless adoption of CPO technology into next-generation XPUs, improving bandwidth density, latency, and power efficiency.

Revolutionizing AI Compute with Co-Packaged Optics

Marvell custom AI accelerator architecture combines XPU compute silicon, HBM, and other chiplets with Marvell light engines on a common substrate, leveraging high-speed SerDes, die-to-die interfaces, and advanced packaging technologies. By integrating optical connectivity within the XPU package, the architecture eliminates the need for external copper cabling or PCB traces, achieving data transfer distances 100x longer than electrical interconnects while reducing power dissipation and latency.

Industry Leaders on the SENKO-Marvell Collaboration

“Co-packaged optics system designs call for detachable optical connectors that maintain optical signal integrity with low coupling loss,” said Nick Kucharewski, senior vice president and general manager, Cloud Platform Business Unit, Marvell. “Our collaboration with Senko has enabled multi-fiber integrated connectors with the attributes our customers demand for advanced next generation systems.”

“The integration of our detachable 36Ch optical Metallic PIC (MPC) connector into the Marvell custom XPU architecture is a fundamental enabler for wider CPO adoption across cloud hyperscalers and AI factories,” said Obie Roy, Director of Business Development, Emerging Technologies Group at SENKO Advanced Components.

“Our collaboration with Marvell highlights SENKO’s commitment to accelerating the deployment of CPO through fiber optic connectivity solutions that enhance performance, scalability, and power efficiency for next-generation AI servers,” added Ryan Vallance, Vice President, Emerging Technologies Group, SENKO Advanced Components.